Online information source for semiconductor professionals

ODP for post-lithography metrology of 3D structures

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Kelly Barry & Sanjay Yedur, Timbre Technologies, Inc., Santa Clara, CA, USA#


Optical digital profilometry (ODP) has for years been implemented for the metrology of 2D (i.e., line-space) structures at various process levels, including lithography, etch, and CMP. ODP provides critical dimension, crosssectional profile, and film thickness information for both stand-alone and integrated metrology applications. ODP is now being implemented for metrology of 3D hole and island structures for both lithography and etch process development and monitoring. This article discusses the application of 3D ODP metrology to post-lithography structures, where measurements of critical parameters can be made immediately following the lithography process, in a method nondestructive to the wafer. The results show that ODP can be used successfully to monitor CD, film thickness, and profile variation. Tool-precision results indicate the stability of the measurement process, and correlation to CD-SEM is also provided as a reference metrology, demonstrating that ODP is a viable 3D-metrology solution.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Infrared metrology for shallow recess structures in deep trench DRAM - 01 September 2007

Metrology challenges for the photolithography masks - 01 June 2004

Litho metrology challenges for the 45nm technology node and beyond - 01 March 2006

New Product: Nanometrics targets advanced CD control issues with NanoCD Suite - 11 February 2008

Metrology Issues in the Age of Next Generation Lithography - 01 March 1999

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: