Online information source for semiconductor professionals

Modular Gas Systems provide Versatility, Serviceability, and Ease of Assembly

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

JOHN BAXTER, Swagelok Company, Solon, OH, USA

ABSTRACT
Nearly every process that adds, alters, or removes material on silicon wafers uses process gases, which are distributed through stainless steel tubing and controlled and measured by valves, filters, gas purifiers, pressure regulators and transducers, etc. The layout of these combined components – known as the gas stick – has undergone radical design changes in recent years as it keeps pace with the fast-changing wafer fabrication technology. Conventional gas sticks, fabricated with welds and tube fittings, are increasingly giving way to modular gas systems, which, in their latest generation, offer decided benefits in terms of footprint, serviceability, accessibility, and design versatility.
Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

New Product: Intevac‚??s novel ‚??Lean Etch‚?? platform posts 200wph productivity - 24 August 2007

Enhancing process control flexibility for sub-90nm applications - 01 March 2005

Prospects of incorporating directed self-assembly into semiconductor manufacturing - 01 December 2007

Tool Order: Mattson receives its largest etch tool order - 09 March 2011

CyberOptics to use Hermes-Epitek for Southeast Asia sales push - 06 January 2010

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: