Online information source for semiconductor professionals

Mixed Abrasive Slurry: A Study on Metal CMP

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

ANURAG JINDAL, SHARATH HEGDE & S.V. BABU, Clarkson University, Potsdam, NY, USA


Chemical Mechanical Polishing (CMP) has been widely recognised as the only viable technique to eliminate topographic variations and accomplish global planarisation for Ultra Large Scale integrated (ULSI) circuits. Slurry forms an integral part of a typical CMP process. Conventional slurries contain single type of abrasives and suffer from issues such as polish rate selectivity, surface quality and slurry stability. Recently, we have proposed formulation of Mixed Abrasive Slurries (MAS) to overcome some of these issues [1, 2]. MAS is a suspension of two or more types of abrasive particles in a chemical solution. This paper discusses the results on metal polishing using MAS containing a mixture of alumina and silica particles. These slurries demonstrate high selectivity to tantalum with an improved surface quality during copper damascene CMP process. This improved CMP performance is explained based on the particle-particle and particlesurface interactions.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Advanced CMP consumable design for defectivity control - 01 December 2004

Slurry metering for CMP - 01 March 2003

Advanced technologies in CMP slurry systems reduce wafer damage - 01 March 2003

Challenges of Electroplated Copper Film and Device Characteristics for Copper Slurry Design - 01 March 2000

Effect of pump type on the health of various CMP slurries - 01 April 2007

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: