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KEITH W. LEUNG & CHRIS A. PAPADIMOS, Advanced Engineering Solutions, Fairfax, CA,USA

ABSTRACT

The microelectronics industry is at the threshold of the 300-mm transition and appropriate vibration criteria for the design of next generation chip fabrication (fab) facilities have not been formally proposed. This article identifies the need for modifications to the “generic” vibration design criteria to address the low frequency sensitivities of metrology tools. For steppers and scanners active vibration isolation is becoming a feasible way to mitigate external and internal vibrations. We believe that better engineered tools will be the primary driver towards successful chip fabrication for linewidths at and below 0.15 microns. The historical “generic” criteria, with our proposed modifications, will provide a solid basis for the design of next generation fabs.