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Scott Stewart, Intel Corporation, Hillsboro, OR 97124-6497, USA

ABSTRACT

This article explores the challenge faced by semiconductor manufacturing facilities to reduce their environmental footprint and avoid regulatory constraints. Wafer fabs continue to increase in size and complexity, while regulatory emissions limits continue to shrink. The focus is on volatile organic compound emissions (VOCs), which pose the most likely constraining air permit limit. Areas covered include common air permit limits and requirements, analysis of VOC sources at a typical semiconductor facility and examples of wins from Intel’s VOC reduction toolbox including improved waste management procedures. Finally, attention is given to remaining emissions problems and what must be done to ensure future manufacturing capability.