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Low k films for integrated circuit IMD applications: CVD or spin-on?
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Neil H. Hendricks, ATMI, San Jose, CA, USA
ABSTRACT
In order to continue advanced IC development, intermetal dielectrics with lower dielectric constants must be used. Two main application techniques for these films exist, chemical vapor deposition (CVD) and spin-on. This article revues the past history and current status of these techniques and discusses the possibilities for future development considering the actions of both the semiconductor manufacturers and the equipment suppliers.
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