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Low-k Dielectrics for Future IC Fabrication

01 December 2000 | By Mark Osborne | White Papers > Edition 11, Wafer Processing

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PETER SERMON, KNUT BEEKMANN AND SIMON MCCLATCHIE, Trikon Technologies Ltd., Newport, South Wales

ABSTRACT

New dielectric materials offering lower dielectric constants than silicon dioxide are needed for the manufacture of faster computer chips. In this article we survey the challenges involved in finding the right material.

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