By Sven Grünzig, Nemotek Technologie, Rabat, Morocco
ABSTRACT
The paper presents a calculation model and conclusions with focus on the
comparison of low-throughput and high-throughput lithography clusters
via an analysis of the lithography Cost of Ownership (COO) and applied
data of the Overall Equipment Efficiency (OEE) and Overall Factory
Efficiency (OFE). The report will show that the published documents up
to today are not sufficient to prove that a higher throughput
necessarily leads to an advantage of the manufacturing effectiveness and
that it is necessary to calculate and adapt it onto the chip
manufacturer’s requirements. It will show metrics and a methodology for
fab planners and equipment engineers to calculate the needed cluster
throughput and to optimize the lithography efficiency. Furthermore, the
calculation model presents a flexible method to identify not only the
key drivers to run an efficient production, but also to easily compare
different scenarios. Two examples are shown, with models evaluated with
real data. This study might also be applicable to other semiconductor
processing steps.
Lithography efficiency: a cost comparison model, Sven Grünzig, Nemotek Technologie