Online information source for semiconductor professionals

Ion Chromatography and Capillary Electrophoresis in Large-Scale Manufacturing of Semiconductor Silic

01 June 2000 | By Mark Osborne | White Papers > Edition 12

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

THOMAS EHMANN, LASZLO FABRY, JAMES MORELAND & JÜRGAN HAGE,Wacker Siltronic AG, Burghausen, Germany
MARIA SERWE, Agilent Technologies GmbH, Waldbronn, Germany

ABSTRACT

Crystalline perfection and cleanliness of silicon wafers are becoming limiting factors for increasing integration density of semiconductor devices. Both crystalline perfection and cleanliness of the wafers depend upon the cleanliness of process chemicals, process environment and process variations. Monitoring process hygiene requires sophisticated ultratrace microanalytical techniques that are capable to control process cleanliness and to assure product quality down to the lower ppt-range (pg/ml) [1,2]. As a rule of thumb, reference materials, analytical environment and analytical chemicals must be one order of magnitude cleaner than the process conditions to allow dependable analytical results on processes and products.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Atomic Force Profilometry for Chemical Mechanical Polishing Metrology - 01 March 2000

Semprius to use X-FAB after US$1.5 million investment from the foundry - 12 January 2010

The Impact of Conveyor Transports on Factory Performance at Infineon‚??s (Siemens) 200-mm Fab - 01 December 1999

Identifying the Types and Potential Sources of Airborne Molecular Contamination: A Multi… - 01 March 2000

Tribology issues in CMP - 01 March 2003

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: