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Neil Truscott, Infineon Technologies SC300 GmbH & Co Kg, Dresden, Germany

ABSTRACT

This article will discuss the benefits three-dimensional templates have on installing fabrication equipment using a “Plug and Play” approach. 3D templates are not new for the industry and have widely been used in Asia. The current challenge is successfully developing 3D templates for a whole new generation of semiconductor manufacturing equipment. Here lies the real challenge, in working with the OEM’s to successfully develop such templates when the OEM’s real focus is still transferring Alpha and Beta technology into reliable production systems, and during this process to track and keep up to date with last minute design and configuration changes. This was where the FAB of the Future (FoF) Equipment Team and its engineers had to break new boundaries, in maintaining focus on what can be considered a trivial topic, yet being successful at the same time. Otherwise the template concept can become more costly than beneficial, as has been the case in the past.