MARTIN EMRICH, MACROTRON Systems GmbH, Munich, Germany
PAUL MILLER, DOUG PRICE & CHARLES BOWERS, Eco-Snow Systems, Inc., Livermore, CA, USA
ABSTRACT
A‘dry’ carbon dioxide process has been investigated as a replacement for conventional solvent and deionised-water spray techniques for metal lift-off process steps. Results show that wafer yield is improved as a result of reduced electrical degradation and particle density. We also observe reductions in contact resistance between the interconnect metal and ohmic metal layers of greater than 20%.