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In Situ Single Chamber Processing: A Proven Capability for Dielectric Etch Processes
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STEVE LASSIG, Lam Research Corporation, Fremont, CA, USA
ABSTRACT
In situ processing, where multiple operations are performed in a single chamber without interruption, is fast becoming an important industry trend for improving cost of ownership (CoO), productivity, and performance. Though the benefits are significant, the challenges and complexity of integrating multiple processes have slowed development until now. Technologies developed for dielectric and silicon etch at Lam Research Corporation enable this approach. In this paper, several key dielectric etch applications are discussed – including in situ etch processing for high-aspect-ratio contact (HARC) and dual damascene – which are now in production.
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