Online information source for semiconductor professionals

In Situ Single Chamber Processing: A Proven Capability for Dielectric Etch Processes

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

STEVE LASSIG, Lam Research Corporation, Fremont, CA, USA

ABSTRACT

In situ processing, where multiple operations are performed in a single chamber without interruption, is fast becoming an important industry trend for improving cost of ownership (CoO), productivity, and performance. Though the benefits are significant, the challenges and complexity of integrating multiple processes have slowed development until now. Technologies developed for dielectric and silicon etch at Lam Research Corporation enable this approach. In this paper, several key dielectric etch applications are discussed – including in situ etch processing for high-aspect-ratio contact (HARC) and dual damascene – which are now in production.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

New Product: Applied Materials offers BLOk II PECVD system for barrier films at 45nm and below - 04 June 2007

New Product: Intevac‚??s novel ‚??Lean Etch‚?? platform posts 200wph productivity - 24 August 2007

A Breakthrough in Low-k Barrier/Etch Stop Films for Copper Damascene Applications - 01 March 2000

New Product: EtchTemp SensorWafer from KLA-Tencor can characterize high-power, high-frequency etch - 23 April 2009

New Product: Applied‚??s ‚??Enabler E5‚?? etch system enables 40:1 high aspect ratio contact feature - 05 December 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: