Online information source for semiconductor professionals

Improving Processes Through RF Power Control

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

CARL ALMGREN, JIM EVANS & RANDY HECKMAN, Advanced Energy Industries, Inc., Fort Collins, CO, USA

ABSTRACT

Plasma-based processes are critical to the fabrication of semiconductor device structures and to the integrity of CDs. PVD, HD-PCVD, PECVD, dry etch, and strip all rely on dc and RF sources to ignite and maintain the energy of the plasma to do work. To date, control of power has been regulated on the output of the generator (i.e. forward power), rather than the input of the plasma (i.e. delivered power). There are numerous historical and technical reasons why this has been the case, but the net effect is that the power output of the generators (sources) is never the power input to the plasma. Most power losses are accounted for in the match network between the generator and the plasma. Additionally, dynamic changes in the impedance of the plasma contribute to variations in delivered power. There are multiple methodologies available to deliver power to the plasma, using fixed match, switch match, auto-selectable switch match, and sweep frequency. Further, these methods are very amenable to point-of-use delivered power control. This paper focuses on the benefits to be derived from two of these methods: fixed match and closed-loop delivered power control.
Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

New Product: AE‚??s Paramount RF-power delivery system has network analyzer type accuracy - 05 July 2007

ABB acquires Czech power semiconductor firm to meet switching device demand from renewable energy - 29 March 2010

advanced characterization for copper interconnect technology - 01 December 2005

Is TI‚??s high k on the highway? - 19 September 2005

Copper Removal Processes for Microelectronics Applications - 01 June 2001

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: