Online information source for semiconductor professionals

IBM‚??s SiGe BiCMOS technology roadmap

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

D.L. Harame, J.S. Dunn, A. Joseph, S.A. St. Onge, D. Coolbaugh, V. Ramachandran, J. Johnson, P. Cottrel, R. Singh, C. Dickey, IBM, Essex Junction, Vermont,USA, G. Freeman, D. Ahlgren, D. Greenberg, J.-S. Rieh, B. Jagannathan, S.Subbanna,IBM, Hopewell Junction, NY, USA, M. Meghali, IBM Yorktown Hts., NY, USA, O. Schreiber,MCC, San Diego, CA, USA, & T. Tanji, AMCC, Edina, MN, USA

ABSTRACT

This article reviews the evolution of IBM’s SiGe BiCMOS technology roadmap. It begins with a discussion of the wireline communications products that drive the initial high-performance target of the roadmap: the latest advanced CMOS and highest performance (high fT and fMAX) HBT. These requirements establish the CMOS integration approach and drive the initial SiGe HBT design. Subsequent wireless and storage demands are focused on traditional radio requirements: Optimization of the HBT for low noise, low distortion and higher breakdown voltages. These product segments further drive the derivative technologies to more simplified states for lower cost and faster TAT. Taking this perspective on the evolution of the SiGe BiCMOS reveals that the roadmap for the this technology has been developedto serve dissimilar markets with a flexible technology backbone that provides a path to reduce cost and time to market. 

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

The SiGe:C Epitaxy Process - 01 June 2001

Jazz juggles with low cost 130nm process - 05 October 2005

Jazz Semiconductor offering DSV process on 180nm SiGe BiCMOS process - 29 September 2009

austriamicrosystems increases offerings for multi-project wafer service - 24 November 2009

Innovations in Silicon Germanium Bicmos Processing - 01 June 2000

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: