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High Pressure Forcefill® PVD for Advanced Aluminium Metallization D. C.

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D. C. BUTLER, Trikon Technologies Ltd., Newport, Gwent, UK
M. N. WEBSTER, A. G. DIRKS, Philips Research Laboratories, Eindhoven, The Netherlands

ABSTRACT

As dimensions shrink, packing densities rise and vertical integration continues, device manufactu rers are seeking metallization solutions that combine low costs with high performance and reliability. In the fields of high performance micro processors and DRAMs, new interconnect challenges are testing device engineers and equipment vendors.

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