Online information source for semiconductor professionals
High-k/metal gate materials and processes for 32nm technology
Popular articles
Voltaix names Peter Smith as CEO - 09 November 2011
Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
C. S. Park, G. Bersuker, S. C. Song, P. Kirsch & B. H. Lee, SEMATECH, Austin, Texas; R. Jammy, IBM assignee to SEMATECH
ABSTRACT
This paper describes recent progress in high-k/metal gate stacks required for MOSFET scaling to the 32nm technology node. Band-edge metals for n- and p-MOSFETs have been developed through effective work function (WF) tuning, achieved by optimized doping of the high-k gate stacks. The mechanism of the EWF tuning is the dipole formation at the interface of the high-k dielectric and SiO2 interfacial layer. Possible solutions to the flatband voltage (Vfb) roll-off issue were obtained, an issue that presents the most significant challenge to achieving low pMOSFET threshold voltage (|Vt|) at low EOTs. The gate-first high-k/metal gated n- and pMOSFETs with low |Vt| and low EOT suitable for 32nm technology node applications have been successfully demonstrated.
 |
Please login to download the paper. No account yet? Please register. It's free! |