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Fast, In-line Copper Metrology Using Optoacoustics

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ALEC READER, MICHAEL GOSTEIN, JOSHUA TOWER & CHRIS MOORE, Philips Analytical, Almelo, The Netherlands

ABSTRACT

The introduction of copper as the conductor of choice in circuit interconnects has led to new manufacturing challenges and a need for nontraditional metrologies. Successful production will demand cost-effective, non-destructive monitoring of metal film thickness in real time. This goal of real-time feedback from product wafers is now within reach using optoacoustic metrology. The article discusses a project involving Philips Analytical and International SEMATECH on optoacoustics for copper metrology, and compares the measurements to traditional results from electrical tests and profilometry. It also outlines the potential for in-line or integrated process control.

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