Online information source for semiconductor professionals

Extreme Ultraviolet Lithography: status and challenges ahead

01 September 2003 | By Mark Osborne | White Papers > Edition 19, Lithography

Popular articles

Voltaix names Peter Smith as CEO - 09 November 2011

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Vivek Bakshi, Jerry Cullins, N.V. Edwards, Kevin Kemp, Pat Marmillion, Jan-Peter Urbach, Thomas White & Obert Wood, International SEMATECH, Austin, TX, USA

ABSTRACT

The purpose of this article is to provide an update of the current status and most recent advances in each of the specific areas of sources, masks, optics, photoresists and microexposure tool for extreme ultraviolet lithography. The article is therefore organized according to these topics, with a brief discussion of the issues surrounding each, the current development status, and future outlook. A sustained study on the development of industry infrastructure for EUVL is underway at International SEMATECH. Although significant challenges remain, progress is being made on various technical fronts.

Download Please login to download the paper. No account yet? Please register. It's free!

Related jobs

No related jobs found, sorry!

Related articles

Tool Order: HamaTech supplies 30th advanced photomask cleaning system - 04 July 2008

Grand challenges of advanced resist technology - 01 June 2005

ASML expects over €2 billion in bookings for fourth quarter - 09 December 2010

TOK to develop EUV photoresists at SEMATECH - 29 April 2009

Resolution Enhancement Techniques in Optical Lithography - 01 December 1999

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: