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KRISTYN MALINA, Environmental and Occupational Risk Management, Inc., Austin, TX, USA

ABSTRACT

Based on the trend towards smaller microprocessor feature sizes and the physical properties of copper, the use of copper-based deposition processes in semiconductor processing is increasing. This article describes several types of copper-based semiconductor fabrication processes and provides a detailed analysis of the environmental regulatory issues associated with the introduction of copper-based deposition processes into integrated circuit (IC) manufacturing operations in the United Kingdom, Ireland, Singapore and Taiwan. The analysis addresses integrated permitting requirements, where applicable, as well as individual air emissions, liquid effluent and solid waste limitations and restrictions.