By Reiner Missale, Qimonda AG, Germany
ABSTRACT
300mm technology has forced the semiconductor industry to take a broader perspective on the classical understanding of production and Shop-Floor Control. As a consequence, the focus shifted from the perspective of Transport Automation and Manufacturing Execution Systems to the integrated Factory, viewing all involved elements for semiconductor production. In pre-300mm, the process-engineering domain saw limited overlap to production logistic and transport. Today the linkage and integration of process control and shop-floor control and production logistic is acknowledged as a key factor for operational excellence. These are the Enabling Technologies for the high-end “Manufacturing Operations Management”.
The required technologies for the integrated manufacturing are not available off-the-shelf in the market. Unlike in the financial and enterprise resource planning area, the shop-floor is lacking in predefined workflows, addressing and providing the work-procedures and work–processes with highly automated semiconductor operations. This paper gives real-case insight on
- how to build a comprehensive standard for the high-end automation and production efficiency
- how to increase process control, equipment utilization and factory uptime towards better cycle time and output through an integrated industrial automation solution baseline for shop-floor and engineering.