Online information source for semiconductor professionals

Edition 38: 2008 Semiconductor manufacturing survey results and the fabs of 2013

26 January 2009 | By Patricia Johnson | White Papers > Edition 38

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

FT382008 Semiconductor manufacturing survey results and the fabs of 2013 - David Jimenez & Daren Dance, Wright Williams & Kelly, Inc., Pleasanton, California, U.S.


In April of 2007, WWK conducted a survey of semiconductor industry professionals and asked several questions pertinent to the semiconductor manufacturing industry, including the respondents’ expected arrival date of 450mm wafers and the likelihood of direct write patterning being incorporated into more manufacturing processes. A follow-up survey was carried out in 2008, and these combined sets of data are portrayed in a projection of a typical manufacturing facility in 2013.

Related articles

Considerations regarding the appropriate timing for advanced technology facility vibration surveys - 01 March 2005

An Assessment of the Current State of Automatic Defect Classification Technologies, Tools and Practi - 01 March 2002

Technology Considerations For Future Semiconductor Data Management Systems - 01 June 2000

Wet and dry 193nm ArF lithography key choice for 32nm node production - 22 May 2008

MEMS microphone shipments set for rapid growth, says iSuppli Corp - 24 September 2009

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: