Online information source for semiconductor professionals

Discussion topic: latest developments in EUV light sources

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Discussion panel contributors include: Dr. Vivek Bakshi, SEMATECH, Austin, Texas, USA, Dr. Martin
McCallum, Manager, Advanced Lithography and Technology, Nikon Precision Europe GmbH, & Dr. Vadim
Banine, ASML, Veldhoven, The Netherlands

ABSTRACT

Significant improvements in EUV light sources have been made in the last 12 months, resulting in renewed
hope that one of several key barriers to the eventual adoption of EUV
as the mainstream lithography technology below the 32nm node
may be close to being overcome. Development work has been carried
out around the world and within key working groups. We asked some of
these groups to provide insight into what has been achieved and what is
still needed to be done before EUV lithography shows the light of day!

Mark Osborne, Semiconductor Fabtech, Editor-in-Chief

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Magnetic fields and the technology challenges they pose (a semiconductor perspective) - 01 December 2005

New Product: Cymer focus drilling technology improves DOF for immersion lithography tools - 02 March 2011

The State of Array Packaging - 01 December 1999

Cymer shipped 50 light sources in the First Quarter 2011: EUV investments increasing - 26 April 2011

Cymer suffers same ill as ASML as capex pause to hit shipments - 25 July 2011

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: