Online information source for semiconductor professionals

Development of a BEOL post-etch cleaning process for cu/low-k integration using the SEZ single wafer

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

L. Broussous, P. Besson, O. Hinsinger, T. Billon, S.A. Henry, M. Frank STM microelectronics, 850;Rue Jean Monnet, F38926, Crolles Cedex, France CEA-Leti, 17 rue des Martyrs, 38054 Grenoble Cedex 09, France SEZ AG, Draubodenweg 29, A9500 Villach, Austria


This work represents the investigation of the improvement of cleaning efficiency related to the use of the SEZ Spin Processor 203 in comparison to a static wet bench on Cu on SiOC and porous SiOC structures The focus was on postetch cleaning for 90-nm and 65-nm technology nodes with SiOC and porous SiOC dielectrics. A screening was performed to evaluate chemistries compatible with all the dielectrics involved in SiOC and porous SiOC integration. The chemicals were selected from previous experiments at Leti, in collaboration with Crolles 1 R&D teams, as well as new propositions from chemical suppliers. Electrical and analytical data were used to evaluate the chemicals for post-etch cleaning of Cu and low-k.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Tool Order: FSI International wins repeat order from foundry - 07 July 2011

Post-etch cleaning chemistries evaluation for low k-copper integration - 01 March 2003

Tool Order: FSI‚??s new ‚??ORION‚?? single wafer cleaning system in 32nm BEOL evaluation - 20 May 2008

New Product: SEZ‚??s ‚??Esanti‚?? platform tackles 45nm volume production single wafer FEOL cleaning - 28 November 2006

Tool Order: U.S.-based IC manufacturer places follow-on Orion order with FSI - 07 October 2009

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: