Online information source for semiconductor professionals

Defect Reduction Methodology in the Lithography Module

01 December 1999 | By Mark Osborne | White Papers > Edition 10, Lithography

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

INGRID B. PETERSON, KLA-Tencor Corporation, Milpitas, CA, USA


One of the challenges facing the implementation of DUV and advanced i-line lithography processes in production is that of maintaining low defect density in order to minimize the impact on yield. Yield depends on the complex interaction between design, CD and overlay control, films, electrical parameters, and defects. As the geometries shrink and the chip size increases, defect reduction becomes increasingly important. Defect density is just as important as critical dimension and overlay metrology in the development and implementation of lithography processes. Achieving and maintaining low-defect density lithography processes necessary for sub-quarter micron technologies requires a defect reduction methodology that quickly detects critical defects, reduces yield-limiting excursions and minimizes cost. This methodology encompasses test and product-wafer inspections combined with a careful selection of the defect inspection tool. Automated defect classification, (ADC) cuts the time to results: it facilitates defect source isolation (essential in defect-level baseline reduction) and excursion control enabling an easy implementation of SPC limits by critical defect types. A sampling strategy that balances the cost due to inspection versus cost due to defect excursions is required.
Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Process Control and Defect Inspection Strategies for 300mm Fabs - 01 December 2002

Tool Order: Taiwan DRAM manufacturer selects inspection package from Rudolph - 15 June 2009

Advanced CMP consumable design for defectivity control - 01 December 2004

New Product: Rudolph reduces CoO for macro defect inspection with new AXi 940 module - 15 May 2008

EUVL Symposium: source, mask defects & resists remain challenges - 15 October 2008

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: