Online information source for semiconductor professionals
Current issues in defect detection and review: bevel-edge inspection and in-line elemental analysis
Popular articles
Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008
Numonyx to close California Technology Center - 12 August 2008
Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008
Micron close to Inotera share purchase, says Gartner - 06 October 2008
Applied Materials sees higher CapEx spending for 2009 - 15 August 2008
Dilip Patel, Intel assignee, ISMI, USA, & Milton Godwin, ISMI, Austin, Texas, USA
ABSTRACT
New issues have appeared recently in the landscape of defect detection and review. A need to examine defects in the bevel-edge portion of the wafer has grown in proportion to the recoverable edge ‘real estate’ on larger wafers. Further, inherent limitations to in-line elemental analysis have been identified, using scanning electron microscopy/energy-dispersive X-ray spectroscopy (SEM/EDS), as defects of interest become smaller than 100nm in diameter. This article recounts how International SEMATECH Manufacturing Initiative (ISMI) has examined these issues, conducting surveys of vendors and analysis laboratories to seek pathways to enable new and more promising techniques of inspection and review.
 |
Please login to download the paper. No account yet? Please register. It's free! |