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Critical component requirements for ALD technology
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Mark Osborne, Editor-in-Chief, Semiconductor Fabtech
ABSTRACT
Atomic Layer Deposition (ALD) has long been hailed as a next generation technology, enabling semiconductors to enter the nanoworld that promises to keep pace with the demands of Moore’s Law. Only in the last two years has this technology moved from the lab into the fab. The pace of adoption is expected to increase significantly at the 70nm node for DRAM and the 65-45nm nodes for logic. ALD is a variant of chemical vapor deposition (CVD) and therefore requires reactor and reactor-related components for operation under controlled vacuum conditions. However the demands are greater than with a typical CVD process. This has led to the need to develop components able to withstand the exacting requirements of ALD. Emphasis is also turning to the requirements of high volume production environments that include cost of ownership and mean time between failure issues. Here we investigate the latest developments in critical components for volume production ALD.
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