Online information source for semiconductor professionals
Cost of Ownership Challenges in Front-End Thermal Processes
Popular articles
Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008
Numonyx to close California Technology Center - 12 August 2008
Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008
Micron close to Inotera share purchase, says Gartner - 06 October 2008
Applied Materials sees higher CapEx spending for 2009 - 15 August 2008
Alan Levine, Wright Williams & Kelly, USA
ABSTRACT
The use of new ultrapure polysilicon furnaceware has a dramatic impact on the cost of ownership for the entire LPCVD polysilicon process. Benefits are demonstrated in cost reduction and increased productivity. Further benefits are demonstrated for yield, which is quantified in cost of ownership as a change in scrap costs. Sensitivity analysis allows these results to be extrapolated to a wide range of situations.
 |
Please login to download the paper. No account yet? Please register. It's free! |