Online information source for semiconductor professionals

Cost of Ownership Challenges in Front-End Thermal Processes

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Alan Levine, Wright Williams & Kelly, USA


The use of new ultrapure polysilicon furnaceware has a dramatic impact on the cost of ownership for the entire LPCVD polysilicon process.  Benefits are demonstrated in cost reduction and increased productivity.  Further benefits are demonstrated for yield, which is quantified in cost of ownership as a change in scrap costs.  Sensitivity analysis allows these results to be extrapolated to a wide range of situations. 


Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Tool Order: Mattson‚??s Helios XP RTP system installed at Asia-based foundry‚??s R&D facility - 24 August 2010

Tool Orders: Japanese 300mm fab orders Therma-Wave‚??s Opti-Probe systems - 19 October 2005

Activity-Based Fab Cost-of-Ownership Modelling for Prediction and Optimization of Profitability - 01 December 1999

Rudolph ships new Explorer Inspection Cluster and installs Macro Inspection system - 03 December 2008

In Situ Single Chamber Processing: A Proven Capability for Dielectric Etch Processes - 01 March 2002

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: