Online information source for semiconductor professionals

Cost of Ownership Challenges in Front-End Thermal Processes

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

Alan Levine, Wright Williams & Kelly, USA

ABSTRACT

The use of new ultrapure polysilicon furnaceware has a dramatic impact on the cost of ownership for the entire LPCVD polysilicon process.  Benefits are demonstrated in cost reduction and increased productivity.  Further benefits are demonstrated for yield, which is quantified in cost of ownership as a change in scrap costs.  Sensitivity analysis allows these results to be extrapolated to a wide range of situations. 

 

Download Please login to download the paper. No account yet? Please register. It's free!

Related jobs

Quality Assurance Engineer - Tokyo Electron Limited - Santa Clara , 30 October 2007

Diffusion Engineer - AMI Semiconductor - Pocatello, 10 August 2007

Analog IC Design Engineer - AMI Semiconductor - Austin, 10 August 2007

Analog Design Engineer - AMI Semiconductor - Sunnyvale, 10 August 2007

Senior Applications Engineer - Axcelis - Beverly, 09 August 2007

Related articles

Tool Orders: Japanese 300mm fab orders Therma-Wave’s Opti-Probe systems - 19 October 2005

Activity-Based Fab Cost-of-Ownership Modelling for Prediction and Optimization of Profitability - 01 December 1999

In Situ Single Chamber Processing: A Proven Capability for Dielectric Etch Processes - 01 March 2002

ASM International to R.I.P. RTP - 29 April 2008

New Product: Edwards’ iXH vacuum pump series handles sub-60nm harsh process environments - 14 May 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: