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RAJIB AHMED, BRIAN SOPKO & JACOB JORNE, University of Rochester, Rochester, NY, USA

ABSTRACT

Methods of copper removal for microelectronics applications have been explored. We have discussed the mechanisms of the more commonly accepted chemical mechanical planarisation (CMP) processes. We also have investigated the mechanisms of electrodissolution and electropolishing. Two processes for improving the current methods of dual damascene copper processing have been made. One utilises a synergy between CMP and electrodissolution. The other uses electrodissolution as an alternative to bulk copper removal and planarisation. Both merit further investigation and experimentation to determine their viability as accepted alternatives to current copper CMP removal processes.