Online information source for semiconductor professionals

Construction Challenges for the 300 mm Fab

01 December 1999 | By Mark Osborne | White Papers > Edition 10, Cleanroom

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

ALLAN D. CHASEY & SALONI MERCHANT, Arizona State University, Tempe, AZ, USA


The cost of constructing and tooling a semiconductor facility has risen sharply from $14 million in 1996 to the staggering sum that is currently more than $1 billion. This cost is increasing exponentially and is expected to double by the year 2000. While I300I and J300 address the process and tool change required for 300 mm fabs, no concerted effort exists to study the implications on design and construction. This paper will discuss the key areas in which research is needed to facilitate the design and construction of 300 mm fabs by giving the reader a broad overview of these issues, focusing mainly on areas that will have the maximum impact. While not providing solutions, it is intended to be a compilation of much of the discussions on 300 mm technology and to act as a catalyst for further discussion.
Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Effective Construction Cost and Schedule Control - 01 March 1999

Cleanroom Protocol Approaches for the Construction Process - 01 June 2002

Enterprise-wide 300mm Integration - 01 December 2002

Electrochemical deposition challenges for 65nm - 01 March 2003

Extending the Life of Existing Fabs Through Optimization - 01 March 1999

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: