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Construction Challenges for the 300 mm Fab

01 December 1999 | By Mark Osborne | White Papers > Edition 10, Cleanroom

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ALLAN D. CHASEY & SALONI MERCHANT, Arizona State University, Tempe, AZ, USA

ABSTRACT

The cost of constructing and tooling a semiconductor facility has risen sharply from $14 million in 1996 to the staggering sum that is currently more than $1 billion. This cost is increasing exponentially and is expected to double by the year 2000. While I300I and J300 address the process and tool change required for 300 mm fabs, no concerted effort exists to study the implications on design and construction. This paper will discuss the key areas in which research is needed to facilitate the design and construction of 300 mm fabs by giving the reader a broad overview of these issues, focusing mainly on areas that will have the maximum impact. While not providing solutions, it is intended to be a compilation of much of the discussions on 300 mm technology and to act as a catalyst for further discussion.
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