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Challenges of Electroplated Copper Film and Device Characteristics for Copper Slurry Design
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ABSTRACT
Planarizing copper deposited inlays is not a simple problem to solve. The change in crystallite orientation within the infill affects the polishing uniformity and processing wafers from different sources can add to the problems. The various pitfalls are discussed and polishing techniques explained. By using two stage polishing processes with careful control of the slurry chemistry and abrasive particle geometry, excellent surface flatness has been obtained.
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