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Challenges and trends in copper plating technology for 90nm and beyond
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Axel Preusse, AMD Fab 36 LLC & Co. KG & Markus Nopper, AMD Saxony LLC & Co. KG, Dresden, Germany
ABSTRACT
Ever since copper plating together with the dual damascene inegration scheme established itself as the mainstream, filling of via-holes and trenches has been the focus of interest for process engineers as well as integration experts.
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