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Challenges and approaches for introducing TMAl into R&D fab processing
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By Don Baskin & Paul Scheibmeir, ATDF
ABSTRACT
Atomic layer deposition (ALD) has become a leading technology candidate for enabling the semiconductor industry to fabricate devices below 90nm and forge into the realm of nanotechnology. One of the most effective precursors for ALD is trimethylaluminum, (TMAl), a pyrophoric liquid that ignites upon contact with air and reacts violently with water or atmospheric moisture. Because of its reactivity, TMAl requires strict safety protocols for handling, containment, and use. Becoming familiar with and adopting these procedures may require a steep learning curve and rapid assimilation of new safety regiments. Such was the experience of ATDF, the global R&D foundry based in Austin, TX.
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