HANS KRUWINUS & HEINZ OYRER, SEZ AG, Villach, Austria
ABSTRACT
Significantly better productivity and improved cycle times are two aspects of the future of semiconductor manufacturing. Faster cycle times, better equipment utilisation and faster yield ramps dictate a flexible factory with small batch sizes and fab-wide automation. Full automation will be a key foundation for all 300 mm factories; this is a critical enabler for single-wafer lot processing. As the industry continues to move to more single-wafer processing, cycle times will continue to decrease. This article demonstrates the benefits of single-wafer spin-process equipment versus a wet bench. It shows that using single-wafer lot processing keeps us on the industry’s blistering costreduction path.