Online information source for semiconductor professionals

Atomic Layer Deposition Reaches Marathon Maturity

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

ROBERT B. CLARK-PHELPS, ANURANJAN SRIVASTAVA, LANCE CLEVELAND, ANA LONDERGAN, OFER SNEH & THOMAS E. SEIDEL, Genus, Sunnyvale, CA, USA

ABSTRACT

Atomic Layer deposition (ALD) is enabling semiconductor manufacturers to extend their core technology into next generations using higher aspect ratio structures, new materials and thicknesses below ~100A. We review the scope of applications and present marathon data for Al2O3 ALD to provide a basis for ALD use in semiconductor manufacturing.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

ASM teams with Air Liquide on high-k films - 10 December 2009

The critical components of a production-worthy ald system - 01 December 2005

A new step in high-k materials engineering - 01 September 2003

A New SOI Manufacturing Technology Using Atomic Layer Cleaving - 01 June 2000

ASM offers single metal gate stack for 32nm logic processes - 19 May 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: