ROBERT B. CLARK-PHELPS, ANURANJAN SRIVASTAVA, LANCE CLEVELAND, ANA LONDERGAN, OFER SNEH & THOMAS E. SEIDEL, Genus, Sunnyvale, CA, USA
ABSTRACT
Atomic Layer deposition (ALD) is enabling semiconductor manufacturers to extend their core technology into next generations using higher aspect ratio structures, new materials and thicknesses below ~100A. We review the scope of applications and present marathon data for Al2O3 ALD to provide a basis for ALD use in semiconductor manufacturing.