Online information source for semiconductor professionals
Atomic Force Profilometry for Chemical Mechanical Polishing Metrology
Popular articles
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Samsung and Micron gain most market share in DRAM crisis - 17 February 2009
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008
Numonyx to close California Technology Center - 12 August 2008
M. G. HEATON, L. M. GE* & F. M. SERRY, Digital Instruments, Veeco Metrology Group, Santa Barbara, CA, USA
*Currently at Intel Corp., Santa Clara, CA, USA
ABSTRACT
Chemical mechanical polishing (CMP) has become widely used in the semiconductor industry due to its ability to provide global planarisation for a wide range of sub-micron processes. With the widespread adoption of CMP and continually shrinking IC device dimensions, demands on metrology tools to characterise the process have also greatly increased. Higher resolution, higher performance, non-destructive metrology is now required to accurately and repeatably measure both large scale and fine-scale features using the same tool. To meet these needs, we have developed a new tool – the Atomic Force Profiler – that combines the benefits of profilometry and atomic force microscopy.
 |
Please login to download the paper. No account yet? Please register. It's free! |