Online information source for semiconductor professionals

An Overview of Cost of Ownership for Optical Lithography at the 100 nm and 70 nm Generations

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

International SEMATECH, Inc., Austin, TX, USA, *Intel Corporation Assignee


The cost of ownership (CoO) has become a key parameter in the comparison of lithography technologies. This article presents some results from the CoO modelling technique used by International SEMATECH, with specific focus on cost drivers and sensitivities. The principal drivers of the CoO values are mask usage, mask cost, tool throughput, and tool cost. By examining trends in these and other areas, one can identify the areas of highest leverage for proactive cost reduction efforts.
Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

New Product: Brion accelerates Tachyon DFM capabilities for sub 45nm designs - 26 February 2007

Simulation for DUV-Lithography - 01 March 1999

Post-etch residue and photoresist removal challenges for the 45 nm technology node and beyond - 01 September 2006

Cost-Of-Ownership Analysis For 300 mm Lithography Mix-and-Match Applications - 01 June 2000

New Product: Molecular Imprints‚?? ‚??Imprio‚?? 300 assists 32nm lithography R&D - 25 February 2008

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: