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Advances in Airborne Molecular Contamination in 300 mm Process Technology
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KLAUS KÜMMERLE, M+W Zander Facility Engineering GmbH, Stuttgart, Germany
ABSTRACT
Comprehensive AMC prevention, removal and monitoring concepts are an integral part in any advanced contamination-free environment for highyield 300 mm manufacturing. This article will shed some light on the integration of such an advanced concept in a 300 mm process technology wafer fab employing 0.18μm technology and state-of-the-art monitoring instrumentation.
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