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Advanced technologies in CMP slurry systems reduce wafer damage
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Scott Robichaud & Katsuhiro Ohnishi, Asahi
ABSTRACT
Chemical Mechanical Planarization (CMP) slurry systems have created many new challenges in the semiconductor fabrication industry. Certain types of CMP slurries consisting of suspended solids in solution are abrasive, and traditional components used in wet process systems, such as diaphragm valves, can damage these slurries.
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