Online information source for semiconductor professionals
A Revolution in Test – The Death of Packaging
Popular articles
Voltaix names Peter Smith as CEO - 09 November 2011
Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
ABSTRACT
The semiconductor industry is regularly running up against massive technology brick walls that must be dismantled or worked around before progress can continue. Recent advances in device performance and functional integration capabilities have now pushed some ICs to the limits of ATE system capability and also conventional packaging. Fundamental changes are now taking shape that will change the way such high performance components are designed, packaged and tested in the future.
 |
Please login to download the paper. No account yet? Please register. It's free! |