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A Revolution in Test – The Death of Packaging
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ABSTRACT
The semiconductor industry is regularly running up against massive technology brick walls that must be dismantled or worked around before progress can continue. Recent advances in device performance and functional integration capabilities have now pushed some ICs to the limits of ATE system capability and also conventional packaging. Fundamental changes are now taking shape that will change the way such high performance components are designed, packaged and tested in the future.
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