Online information source for semiconductor professionals

A Revolution in Test ‚?? The Death of Packaging

01 December 1999 | By Mark Osborne | White Papers > Edition 10

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

BOB MARINER, VLSI Research (Europe), Biddenham, Bedford, UK

ABSTRACT

The semiconductor industry is regularly running up against massive technology brick walls that must be dismantled or worked around before progress can continue. Recent advances in device performance and functional integration capabilities have now pushed some ICs to the limits of ATE system capability and also conventional packaging. Fundamental changes are now taking shape that will change the way such high performance components are designed, packaged and tested in the future.
Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Intel to go revolutionary - 26 April 2011

GSA boosts focus on 3D IC test flows and test capacity management - 13 June 2011

The Move Towards System-in-a-Package Solutions - 01 March 2000

Tool order: Mattson receives repeat business for ‚??Alpine‚?? etch system - 23 November 2010

Tool Order: Mattson‚??s etch tool selected for wafer level packaging - 19 October 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: