Online information source for semiconductor professionals
A New SOI Manufacturing Technology Using Atomic Layer Cleaving
Popular articles
Voltaix names Peter Smith as CEO - 09 November 2011
Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
ABSTRACT
Anovel technology using atomic layer cleavage has been developed which allows Silicon-on-Insulator processing to be available for many substrate materials. The use of SOI technology is discussed and the atomic cleaving process is described in detail. The advantages of the process to the field of device manufacture are illustrated.
 |
Please login to download the paper. No account yet? Please register. It's free! |