Online information source for semiconductor professionals

A New Angle on Chip Interconnect

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

JAN WILLIS, Simplex Solutions, Mountain View, CA, USA


In recent years, the complexity of chip interconnect has become one of the most significant gating factors affecting chip design and performance. The minuscule wiring that connects the millions of transistors on advanced semiconductors can be thought of as the “freeway system” of the chip. Through these submicroscopic connections, electrical signals flow to the complex network of transistors and diodes that have been painstakingly imprinted into the layers of silicon. This article describes a new approach to chip interconnects.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Critical dimension metrology with small angle x-ray scattering - 01 December 2006

Tool Order: Axcelis gets high energy ion implant upgrade orders - 30 September 2009

Immersion photoresist qualification - 01 June 2007

SRC and selected Universities to form 3D packaging R&D centre - 26 January 2009

Development of multi-levelinterconnect technologies for 2nd generation 65nm node VLSIs - 01 December 2004

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: