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A Cleaning Technology for Improved CMP Performance, Productivity and Integration
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GREG WILLITS & BRIAN FRASER, VERTEQ, Inc., Santa Ana, CA, USA
ABSTRACT
As CMP processing matures, the combined polisher and cleaner equipment set must achieve higher levels of performance and productivity. A new cleaning technology based on single-wafer megasonics is investigated for its ability to improve the productivity of CMP through elimination of brushes and the use of an embedded integration architecture.
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