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Peter Csatáry & Klaus Kümmerle, M+W Zander Facility Engineering GmbH, Stuttgart, Germany#

ABSTRACT

The transition to 300mm wafers, slowed down by the current semiconductor industry downturn, has prompted IC manufacturers to consider the installation of their initial pilot or low volume production lines in existing facilities. Such wafer fabs were typically constructed over a decade ago, starting in the mid-eighties with production utilising 200mm wafers. A model case study, based on the collective experience gained during wafer fab conversion projects from 200mm to 300mm is described in this article. It covers the project procedures implemented, the major differences that were identified and resolved to enable the conversion, as well as the development of the “chemisphere”, a total contamination control approach to extend compatibility of the facility with process technologies in the sub-100nm range.