White Papers

Study of Ni-silicide contacts to Si:C source/drain

01 June 2007 | Edition 34, Wafer Processing

Y. Chob, F. Nourib, R. Schreutelkamp & Y. Kim, Applied Materials Inc., CA, USA, &
S. Mertens, P. Verheyen, J. Steenbergen, C. Vrancken, O. Richard, Z. Tökei, A. Lauwers, H. Bender, B. Van Daele, W. Vandervorst, L. Geenen, P. Absil, S. Kubicek & C. Demeurisse, IMEC, Leuven, Belgium Read more >>

SPM techniques for carrier profiling at advanced technology nodes

01 June 2007 | Edition 34, Wafer Processing

Vito Raineri, Filippo Giannazzo, CNR-IMM, Catania, Italy, & Raffaele Mucciato, 2M Strumenti, Roma, Italy Read more >>

Sidewall metrology technologies for 32nm node and beyond

01 June 2007 | Edition 34, Wafer Processing

Johann Foucher, CEA/LETI-MINATEC, France Read more >>

Immersion photoresist qualification

01 June 2007 | Edition 34, Wafer Processing

Monique Ercken, Roel Gronheid, Ivan Pollentier & Philippe Leray, IMEC, Leuven, Belgium Read more >>

New cooling water control technology facilitates fabs’ water reuse strategies

01 April 2007 | Edition 33, Cleanroom

By Jay Duncombe, Intersil; Eric Madera, Linear Technologies; John Brooks, Daniel Cicero, Dr. Steven Hatch, Brian Jenkins, Kevin Olson and Barry Carroll, Nalco Company Read more >>