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White Papers

Study of Ni-silicide contacts to Si:C source/drain

Y. Chob, F. Nourib, R. Schreutelkamp & Y. Kim, Applied Materials Inc., CA, USA, &
S. Mertens, P. Verheyen, J. Steenbergen, C. Vrancken, O. Richard, Z. Tökei, A. Lauwers, H. Bender, B. Van Daele, W. Vandervorst, L. Geenen, P. Absil, S. Kubicek & C. Demeurisse, IMEC, Leuven, Belgium Read more >>

SPM techniques for carrier profiling at advanced technology nodes

Vito Raineri, Filippo Giannazzo, CNR-IMM, Catania, Italy, & Raffaele Mucciato, 2M Strumenti, Roma, Italy Read more >>

Sidewall metrology technologies for 32nm node and beyond

Johann Foucher, CEA/LETI-MINATEC, France

Immersion photoresist qualification

Monique Ercken, Roel Gronheid, Ivan Pollentier & Philippe Leray, IMEC, Leuven, Belgium Read more >>

New cooling water control technology facilitates fabsā?? water reuse strategies

01 April 2007 | Edition 33, Cleanroom
By Jay Duncombe, Intersil; Eric Madera, Linear Technologies; John Brooks, Daniel Cicero, Dr. Steven Hatch, Brian Jenkins, Kevin Olson and Barry Carroll, Nalco Company Read more >>

UPW contaminants effects and purification technologies for emerging immersion optical lithography

By Bipin Parekh, Michael Clarke, Annie Xia & Joseph Smith, Entegris, U.S. Read more >>

Time synchronization solutions

01 April 2007 | Edition 33, Fab Management
By Gino Crispieri, e-Manufacturing Project PMP, ISMI, Texas, USA Read more >>

Tuned Reticle Enhancements Optimized for Process Response

01 April 2007 | Edition 33, Lithography
Terrence E. Zavecz, TEA Systems

Overlay control requirements for next-generation lithography

01 April 2007 | Edition 33, Lithography
By Eitan Herzel and Mike Adel, KLA-Tencor Corporation Read more >>

Effect of pump type on the health of various CMP slurries

By Mark R. Litchy, Donald C. Grant, CT Associates, Inc., USA and Reto Schoeb, Levitronix GmbH, Switzerland Read more >>