26 November 2008
Product Briefing Outline: FSI International has launched the ‘ORION’ Single Wafer Cleaning System, which is differentiated by the use of a unique closed chamber design permits complete control and containment of the wafer environment, addressing several cleaning-related issues on the critical path for 32nm and 22nm technologies. These include the reduction of material loss during photoresist stripping after ultra shallow implants and the elimination of material loss and galvanic corrosion in high-k metal gates and copper interconnects with metal containing capping layers.
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26 November 2008
Product Briefing Outline: FEI has launched the ‘Magellan’ series that is a new class of instruments called extreme high-resolution scanning electron microscopes (XHR SEMs). The Magellan XHR SEM allows scientists and engineers to quickly see things they could not see before, such as 3D surface images at many different angles and at resolutions below one nanometer (about the size of ten hydrogen atoms, side-by-side. The Magellan XHR SEM images samples at very low beam energies, avoiding distortions otherwise caused by the beam penetrating into the material below.
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26 November 2008
Product Briefing Outline: Novellus Systems has now made available an ashable hard mask (AHM) process configuration for its ‘VECTOR Extreme’ PECVD platform. The new VECTOR Extreme AHM system is targeted at memory megafabs. More than 30 VECTOR Extreme platform systems are to be installed worldwide by the end of 2008, the company said.
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