Sematech has announced that the centrotherm photovoltaics AG subsidiary, centrotherm thermal solutions, will join its Front End Program (FEP) to develop low-temperature processing techniques for use in high-performance logic and advanced memory applications such as metal oxide RRAM devices.
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Himax Technologies, a leading producer of CMOS image sensors, semiconductor devices and power management devices, has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EV Group. The IQ Aligner system will be shipped and installed at Himax’s Tainan facility in Taiwan.
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Camtek, the automated and technological solution provider, has announced that it has booked orders exceeding US$3.5 million for its Falcon family of automated wafer inspection products. The order was from an unnamed global outsourced semiconductor assembly and test house (OSAT) and pertains to various applications within the backend semiconductor process. The product delivery will come in the current and following two quarters.Read more >>
By Oguz Yavas, Ernst Richter, Christian Kluthe & Markus Sickmoeller, Qimonda AG - ABSTRACT - A recent collection of data on 90nm, 80nm and 75nm technology from state-of-the-art 300mm wafer fabs have been brought together to perform a comprehensive analysis of wafer-edge yield engineering. For this study, a dedicated cross-functional team thoroughly investigated wafer periphery using innovative tools such as yield test chips and advanced process inspection. Critical processes were identified and countermeasures implemented to improve overall yield performance. Best practice sharing within the fabrication cluster resulted in a significant learning speed that supported an aggressive global production ramp. The challenges and the methodology used to address fast wafer-edge yield learning in Dynamic Random Access Memory (DRAM) manufacturing are the focus of this paper.Read more >>