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Wafer Processing

News

TEL and Edwards to develop PFC abatement system for dielectric film etching processes

25 November 2008
Tokyo Electron Limited (TEL) Telius Etch toolEdwards and Tokyo Electron Limited (TEL) are to jointly develop a perfluorocarbon (PFC) gas abatement system dielectric film etching processes that will also be able to abate carbon monoxide. The ‘PA-01E’ abatement tool will also be developed with input from Adtec Plasma Technology Co., Ltd., of Japan. Read more >>

UMC validates high-k metal-gate process for 32/28nm nodes

25 November 2008
UMC has said that it has produced working 45nm SRAM test chips using its high-k/metal-gate (HKMG) process technology. According to UMC, this is a major step in validating the technology for inclusion at the 32/28nm nodes. Read more >>

IMFT migrates to 34nm NAND flash production

24 November 2008
IMFT 34nm NAND flash device IM Flash Technologies (IMFT) has claimed the technology leadership for NAND flash production with the news that its 300mm fab in Lehi, Utah has entered production of its 34nm process technology. The monolithic 32Gb NAND device is said to fit into a standard 48-lead thin small-outline package (TSOP), with the die only 172mm² in size. Read more >>

Product Briefings

New Product: ‘ORION’ single wafer cleaning tool from FSI eliminates ashing step for 32nm & below

26 November 2008
FSI ‘ORION’ closed-chamber single wafer cleaning toolProduct Briefing Outline: FSI International has launched the ‘ORION’ Single Wafer Cleaning System, which is differentiated by the use of a unique closed chamber design permits complete control and containment of the wafer environment, addressing several cleaning-related issues on the critical path for 32nm and 22nm technologies. These include the reduction of material loss during photoresist stripping after ultra shallow implants and the elimination of material loss and galvanic corrosion in high-k metal gates and copper interconnects with metal containing capping layers. Read more >>

New Product: The Magellan XHR SEM from FEI enables 3D surface images

26 November 2008
FEI Magellan XHR SEM Product Briefing Outline: FEI has launched the ‘Magellan’ series that is a new class of instruments called extreme high-resolution scanning electron microscopes (XHR SEMs). The Magellan XHR SEM allows scientists and engineers to quickly see things they could not see before, such as 3D surface images at many different angles and at resolutions below one nanometer (about the size of ten hydrogen atoms, side-by-side. The Magellan XHR SEM images samples at very low beam energies, avoiding distortions otherwise caused by the beam penetrating into the material below. Read more >>

New Product: Novellus adds ashable hard mask process to ‘VECTOR Extreme’ PECVD platform

26 November 2008
Novellus VECTOR Extreme AHM systemProduct Briefing Outline: Novellus Systems has now made available an ashable hard mask (AHM) process configuration for its ‘VECTOR Extreme’ PECVD platform. The new VECTOR Extreme AHM system is targeted at memory megafabs. More than 30 VECTOR Extreme platform systems are to be installed worldwide by the end of 2008, the company said. Read more >>

White Papers

Advanced process control of copper electroplating thickness profile

01 March 2008 | Comments (1)
Sai Boyapati, Kevin Chamness, Frank Smith, Patrick Cowan & John Crowley, Spansion, Inc., Austin, Texas, USA Read more >>

Meeting the doping challenges: the case for plasma doping

01 March 2008
Jose I. Del Agua, Tze Poon, Pete Porshnev $ Majeed Foad, Applied Materials, Inc., Santa Clara, California; Malgorzata Jurczak, Jean-Luc Everaert & Wilfrid Vandervorst, IMEC, Leuven, Belgium Read more >>

Contamination control for the 32nm node

01 March 2008
Twan Bearda, Rita Vos, Paul W. Mertens, Gabriela Catana & Cedric Huyghebaert, IMEC, Leuven, Belgium Read more >>