Online information source for semiconductor professionals
300mm Prime and the road to 450mm: Part 1
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: ASML Brionâ??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011
Mark Osborne, Editor-in-Cheif, Semiconductor Fabtech
ABSTRACT
The biggest manufacturing debate in the history of the semiconductor industry is upon us. Unlike the transition from the 200mm wafer size to 300mm where there was eventually a general consensus from a major collection of IC manufacturers, equipment and support service suppliers as to the need for the transition, this is currently not the case with a potential move to 450mm. In this first of a multi-part series of articles planned, we discuss the drivers and the analysis undertaken by the team at International SEMATECH Manufacturing Initiative (ISMI) that lay the groundwork for what is now being hotly debated across the industry in respect to 300mm Prime and ultimately 450mm.
 |
Please login to download the paper. No account yet? Please register. It's free! |