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300mm Activity Report: October - December 2007

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Mark Osborne, Editor-in-Cheif, Semiconductor Fabtech


Continued pricing pressure in both the NAND and DRAM markets in the second half of 2007 has significantly disrupted new 300mm fab construction plans and further capacity ramps at existing facilities. A price war in microprocessors has eased, though price competition has remained strong, forcing AMD to revise plans to fit out its converted 300mm facility Fab 38. As the year ended, capital expenditure plans for leading-edge manufacturers wee becoming clearer with significant spending cuts projected for 2008 compared to 2006 and 2007. We discuss the impact this will have on 300mm fab activity in 2008 and review revised tool install schedules for 4Q07 and 2008 as a whole.

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