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300mm activity report: June to September 2007
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Mark Osborne, Editor-in-Cheif, Semiconductor Fabtech
ABSTRACT
Continued excess inventories, weak selling prices and only slightly improving fab capacity utilization rates are continuing to dampen officially announced new 300mm fab construction plans. Chip manufacturers are continuing to closely monitor end-market demand before committing to new fab ventures. We focus attention in this report on updating new fab tool install schedules and ramp rate activity trends in the foundry sector. We will also discuss the possible impacts that 300mm Prime and the 450mm wafer campaign may have on 300mm fab activity going forward.
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