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300mm Activity Report: 1st Quarter 2002
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BY MARK OSBORNE & JOANNA BOWRING
The move to the next wafer size, like many new technology introductions, is fraught with problems that need to be tackled and solved before they become widespread and prevent the benefits they were originally intended to bring. The driving force for 300mm facilities was the calculated reduction in manufacturing costs, deemed essential in keeping pace with Moore’s Law.
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