Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT

The biggest manufacturing debate in the history of the semiconductor industry is upon us.
Unlike the transition from the 200mm wafer size to 300mm where there was eventually a general consensus from a major collection of IC manufacturers, equipment and support service suppliers as to the need for the transition, this is currently not the case with a potential move to 450mm. In this first of a multi-part series of articles planned, we discuss the drivers and the analysis undertaken by the team at International SEMATECH Manufacturing Initiative (ISMI) that lay the groundwork for what is now being hotly debated across the industry in respect to 300mm Prime and ultimately 450mm.

Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT

Continued pricing pressure in the both the NAND and DRAM markets in the second-half of 2007, has significantly disrupted new 300mm fab construction plans and further capacity ramps at existing facilities. A price war in microprocessors has eased though price competition has remained strong forcing AMD to revise plans to fit-out its converted 300mm facility Fab 38. As the year ended, capital expenditure plans for leading-edge manufacturers were becoming clearer with significant spending cuts projected for 2008 compared to 2006 & 2007. We discuss the impact this will have on 300mm fab activity in 2008 and review revised tool install schedules for 4Q07 and 2008 as a whole. 

Bill McClean, IC Insights, Arizona, USA 

ABSTRACT

The Asia-Pacific region has become a major IC market with significant growth seen in both China and Taiwan. India is being portrayed as the next major country in the region to see strong IC market growth in the next decade. This article discusses that growth through 2011 while highlighting the challenges faced by China and India in competing for a larger share of IC production at a time when every major IC market has large highly entrenched market leaders.

Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT 

NAND flash memory is the fastest growing sector in the semiconductor industry, and is also the most intensely competitive semiconductor manufacturing space. Several major chip manufacturers have entered the market in recent years, while others have established alliances or mergers to remain competitive. In the more traditional NOR flash market, the major manufacturers have found the competitive landscape so strong that none have returned consistent profitability for several years. Spansion is the current market leader in NOR flash but faces key challenges in returning to sustainable profitability and retaining market share leadership. James Doran, Spansion's Executive Vice President and Chief Operating Officer has the task of turning things around.

By Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT

With over-capacity haunting the memory market and a slow recovery in utilization rates at foundries proving elusive, new 300mm fab announcements have remained tempered in the quarter.  A key focus of this repotr concentrates on the dynamics at play at memory manufacturers with regard to new fab announcements, ramp rates, technology migrations and business conditions. 

By Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT

Official new 300mm fab announcements picked up pace in this quarter compared with the previous quarter with a significant number of rumoured fabs in the pipeline.  Asia continues to be the cantre of attention, with Intel Corp. dominating the news with its announcement that it will build its first fab in China.  Although pure-play foundries had a relatively quiet year, 2007 is set to be rather different.  We review new fab announcements, tool install re-scheduling and foundry developments within this report. 

By Mark Stoddard, Association of MBAs, London, England

ABSTRACT

In an increasingly globalized world, there is both greater competition for employment, and a need for people with the skills to manage and lead in a diverse, international business environment.  This need is no more relevant than in the semiconductor industry, in which the last five years has seen an unprecedented growth in global markets.  Managers and engineers are increasingly looking for ways to leverage and enhance their knowledge and skills set in order to become valued business leaders in this field.  The MBA (Masters of Business Administration) degree is an excellent way to achieve these aims for a variety of reasons: it focuses on both the theory and practice of modern management; transforms a functional view of management into a more effective general one; develops the professional 'soft' skills neede for leadership in business; and opens up a number of international opportunities and experiences.  This article explores a number of ways in which an MBA can provide demonstrable value for managers looking to become leaders in the semiconductor industry, and provides essential advice on choosing the right programme. 

Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT
Capital expenditure related to 300mm fab ramps has remained strong throughout
2006; however new fab announcements have declined significantly in the second half of the year compared with the first. That scenario is expected to reverse in 2007 as a number of new fab announcements are expected, and the number of first phase tool installs will hit a new record high! Memory fabs are leading the way with aggressive fab plans, with new builds, ramp rates and in some cases massive capacity levels far exceeding the current average size of 300mm fabs. This report therefore focuses on the activity taking place in the memory market that includes both DRAM & NAND Flash.

Len Jelinek, iSuppli Corp., California, USA

ABSTRACT
Since the great semiconductor crash of 2001, Integrated Device Manufacturers (IDMs) have largely adhered to a business model that minimizes fab costs by outsourcing production of their legacy parts to foundries: the so-called
‘asset-lite' approach. However, it has since become clear that IDMs need a new manufacturing model, one better suited to promoting sustainable growth. IDMs are now contemplating two new models that could potentially revitalize the global semiconductor manufacturing industry: focused manufacturing and collaborative partnerships. In this paper, iSuppli Corp. examines these business models, and the industry forces that have led to their development. 

Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT
New 300mm fab announcements have cooled in comparison with 2Q06, when nine new fab plans were revealed.  This quarter, four fabs were announced but only two are to start construction in 2006.  First phase tool installs are also projected to be down in the second half of the year compared to the first.  However, the number of first phase tool installs are projected to increase sequentially through both the first and second halves of 2007.  Ramp rates are reviewed in some key areas, highlighting the challenges of aggressive 300mm fab ramps. 

Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT

Micron is entering into a new phase of growth and diversification.  Major manufacturing partnerships have been announced and significant capital expenditure is planned to fuel  that growth over the next few years.  Challenged to oversee the expanded operations is Mark Durcan, Micron Technology's CTO and COO. 

Kinam Kim - Semiconductor R&D Div.  Samsung Electronics Co.Ltd.  Korea

ABSTRACT

This article discusses whether memory technologies can continue to evolve beyond the sub-50nm node, in particular, for dynamic random access memory (DRAM) and NAND flash memories. First, the technological barriers that need to be overcome will be addressed, based on the inherent features of the two memory types. Second, technological solutions will be introduced in detail.  Last, manufacturability of each solution will be examined critically. Beyond the 30nm technology node, it is expected that novel transistor schemes with 3-dimensional structures will be incumbent upon both logic and memory array designs, along with the development of new materials. 

By Laura Pressley, Ph.D., Spansion, LLC, Austin, Texas, USA, & Lisa Cheung, KLA-Tencor, Milpitas, Ca, USA

ABSTRACT

Backside and edge/bevel defectivity can negatively impact semiconductor manufacturing tool productivity and sort yields. The importance of a backside and edge/bevel defectivity monitoring program is discussed along with the challenges that will become apparent for 300-mm fabs and for higher technology nodes of 90 nm, 65 nm and below. Multiple examples of backside defectivity issues that caused productivity and yield loses in various IC manufacturing fabs are reviewed. How these defects can detrimentally impact starting Si substrates, photolithography patterning, batch processes such as cleans and vertical furnaces, and CMP processes are discussed. 

ABSTRACT

Intel uses a number of business processes to manage the supply chain for wafer fabs at Intel. We have a program of public quality recognition of top suppliers. There are some major challenges driving our researchers - and this is affecting the workforce in materials. Some of this workforce change is being enabled by our strengths in eBusiness innovation. We are also engaged in the emerging area of repair and refurbishment of spares with the Spares and Service subcommittee of the Supplier Relations Action Council at International SEMATECH. Intel Corporation's Materials Group, with our suppliers, is a large, capable team, providing the infrastructure to really enable Moore's law.